Title
Msiff: A Radiation-Hardened Flip-Flop Via Interleaving Master-Slave Stage Layout Topology
Abstract
This paper presents a radiation-hardened flip-flop called MSIFF. The sensitive node-pairs between the master and slave latches are readjusted at layout-level. It obtains a high SEU tolerance with slight area and performance degradation. A test chip was irradiated with the static and dynamic test modes to validate the SEU tolerance of the proposed MSIFF. Experimental results demonstrate superior performance of the MSIFF over the conventional DICE and D flip-flop.
Year
DOI
Venue
2020
10.1587/elex.17.20190708
IEICE ELECTRONICS EXPRESS
Keywords
Field
DocType
layout hardened design, master-slave interleaving, DICE, sensitive node-pairs, charge sharing
Computer science,Charge sharing,Electronic engineering,Dice,Flip-flop,Master/slave,Radiation,Interleaving
Journal
Volume
Issue
ISSN
17
4
1349-2543
Citations 
PageRank 
References 
0
0.34
0
Authors
5
Name
Order
Citations
PageRank
Ruiqiang Song163.88
Jinjin Shao200.34
Bin Liang3108.28
Yaqing Chi425.16
Jianjun Chen51715.90