Title
Hot Carrier Degradation in Cryo-CMOS
Abstract
28nm Gate First High-K Metal Gate (GF-HKMG) technology is analyzed for Hot-Carrier Degradation (HCD) under varying gate/drain (V <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">G</inf> /V <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">D</inf> ) bias and temperature (T: 300K to 77K). A compact model is used to partition measured threshold voltage shift (ΔV <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</inf> ) into interface trap generation due to pure HCD (ΔV <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">IT-HC</inf> ), Bias Temperature Instability (BTI, ΔV <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">IT-BT</inf> ), and electron/hole trapping (ΔV <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ET</inf> /ΔV <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">HT</inf> ) subcomponents. The relative importance of the subcomponents is analyzed for varying T. Although pure HCD dominates under Cryo-CMOS operation, the T dependence is shown to be different for Si NMOS and SiGe PMOS FETs. Finally, the impact on the circuit (RO: Ring Oscillator) operation is analyzed.
Year
DOI
Venue
2020
10.1109/IRPS45951.2020.9129312
2020 IEEE International Reliability Physics Symposium (IRPS)
Keywords
DocType
ISSN
BTI,HCD,Cryo-CMOS,HKMG,trap generation,charge trapping,RO
Conference
1541-7026
ISBN
Citations 
PageRank 
978-1-7281-3199-3
1
0.39
References 
Authors
0
4
Name
Order
Citations
PageRank
W. Chakraborty110.39
U. Sharma210.39
Suman Datta341551.93
Mahapatra, S.4224.83