Name
Title | ||
|---|---|---|
11.9 A 105Gb/s Dielectric-Waveguide Link in 130nm BiCMOS Using Channelized 220-to-335GHz Signal and Integrated Waveguide Coupler |
Abstract | ||
|---|---|---|
The rapid surge of data transmission within computation, storage and communication infrastructures is pushing the speed boundary of traditional copper-based electrical links. Recent realizations of 100Gb/s wired links require advanced FinFET technologies, highcost packaging/cables and power-consuming equalization. High-frequency waves over dielectric waveguides have been considered as an alternative solution that exploits the low-loss, broadband medium while maintaining compatibility with existing silicon IC platforms. However, since its debut in 2011 [1], this scheme, previously using ≤140GHz carriers, has only achieved data rates of up to 36Gb/s [2]. It is expected that higher carrier frequencies (e.g. >200GHz) and multi-channel aggregation would further increase the data rate while shrinking the interconnect size; but that scheme has been hindered by challenges related to the required high-order multiplexer and ultra-broadband waveguide coupler operating efficiently at sub terahertz (sub-THz) frequencies. In this paper, using a 130nm SiGe BiCMOS technology, we present a multi-channel, multiplexer/coupler-integrated transmitter (Tx) that delivers a data rate of 105Gb/s (3×35Gb/s). To demodulate each channel, a 35Gb/s coupler-integrated receiver (Rx) is also developed. Our link, including the chipset and a 0.4mm-wide, 30cm-long dielectric ribbon, experimentally demonstrates the potential speed, efficiency, size and cost advantages of THz fiber links in high-speed inter-server and backplane fabrics. |
Year | DOI | Venue |
|---|---|---|
2021 | 10.1109/ISSCC42613.2021.9365857 | 2021 IEEE International Solid- State Circuits Conference (ISSCC) |
Keywords | DocType | Volume |
advanced FinFET technologies,power-consuming equalization,high-frequency waves,multichannel aggregation,SiGe BiCMOS technology,coupler-integrated receiver,THz fiber links,dielectric-waveguide link,integrated waveguide coupler,data transmission,communication infrastructures,traditional copper-based electrical links,size 130.0 nm,bit rate 105 Gbit/s,bit rate 35 Gbit/s,size 0.4 mm,size 30 cm,frequency 220 GHz to 335 GHz,SiGe | Conference | 64 |
ISSN | ISBN | Citations |
0193-6530 | 978-1-7281-9550-6 | 1 |
PageRank | References | Authors |
0.48 | 0 | 3 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Jack W. Holloway | 1 | 5 | 0.90 |
| Georgios C. Dogiamis | 2 | 5 | 1.23 |
| Ruonan Han | 3 | 152 | 27.20 |