Paper Info
Title
An interview with Miryung Kim - 2022 SIGSOFT Awardee.
Year
DOI
Venue
2022
10.1145/3561846.3561855
ACM SIGSOFT Software Engineering Notes
DocType
Volume
Issue
Journal
47
4
ISSN
Citations 
PageRank 
0163-5948
0
0.34
References 
Authors
0
1
Name
Order
Citations
PageRank
Jacopo Soldani119027.66