Author Info
Name
Affiliation
Papers
JOHN H. LAU
Electronics & Optoelectronics Laboratories, Industrial Technology Research Institute (ITRI), Chutung, Hsinchu 310, Taiwan, ROC
3
Collaborators
Citations 
PageRank 
24
4
1.52
Referers 
Referees 
References 
15
26
4
Title
Citations
PageRank
Year
Effects of TSVs (through-silicon vias) on thermal performances of 3D IC integration system-in-package (SiP).40.842012
Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package00.342010
Design and analysis of bi-directional pumping silicon Raman laser00.342008