| Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding | 0 | 0.34 | 2015 |
| The Error Prevention Mechanisms of Pointing: Eye Focusing and/or Memory Enhancing? | 0 | 0.34 | 2013 |
| PDN impedance analysis of TSV-decoupling capacitor embedded Silicon interposer for 3D-integrated CMOS image sensor system. | 0 | 0.34 | 2011 |
