Name
Title | ||
|---|---|---|
PDN impedance analysis of TSV-decoupling capacitor embedded Silicon interposer for 3D-integrated CMOS image sensor system. |
Year | DOI | Venue |
|---|---|---|
2011 | 10.1109/3DIC.2012.6263017 | 3DIC |
Keywords | Field | DocType |
electromagnetic fields,impedance,cmos image sensor,capacitors,through silicon via,decoupling capacitor,silicon | Capacitor,Capacitance,Image sensor,Electrical impedance,Decoupling capacitor,Through-silicon via,Electrical engineering,Materials science,Electromagnetic field,Silicon | Conference |
Citations | PageRank | References |
0 | 0.34 | 2 |
Authors | ||
12 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Katsuya Kikuchi | 1 | 4 | 4.16 |
| Chihiro Ueda | 2 | 0 | 1.01 |
| Fumiaki Fujii | 3 | 0 | 0.34 |
| Yutaka Akiyama | 4 | 172 | 37.62 |
| Naoya Watanabe | 5 | 28 | 4.35 |
| Yasuhiro Kitamura | 6 | 0 | 1.01 |
| Toshio Gomyo | 7 | 0 | 0.68 |
| Toshikazu Okubo | 8 | 0 | 0.68 |
| Tetsuya Koyama | 9 | 0 | 1.01 |
| Tadashi Kamada | 10 | 0 | 1.69 |
| Masahiro Aoyagi | 11 | 8 | 9.86 |
| Kanji Otsuka | 12 | 0 | 1.01 |