Author Info
Name
Affiliation
Papers
CHANG HAO
Sch. of Comput. & Inf., Hefei Univ. of Technol., Hefei, China|c|
4
Collaborators
Citations 
PageRank 
15
11
1.64
Referers 
Referees 
References 
32
22
8
Title
Citations
PageRank
Year
Non-Intrusive Online Distributed Pulse Shrinking-Based Interconnect Testing in 2.5D IC40.402020
LCHR-TSV: Novel Low Cost and Highly Repairable Honeycomb-Based TSV Redundancy Architecture for Clustered Faults60.542020
A Pulse Shrinking-based Test Solution for Pre-bond Through Silicon Via in 3D ICs10.362019
Optimized stacking order for 3D-stacked ICs considering the probability and cost of failed bonding00.342014