| A 4 × 4 × 2 Homogeneous Scalable 3D Network-on-Chip Circuit With 326 MFlit/s 0.66 pJ/b Robust and Fault Tolerant Asynchronous 3D Links. | 2 | 0.47 | 2017 |
| 8.1 a 4x4x2 homogeneous scalable 3d network-on-chip circuit with 326mflit/s 0.66pj/b robust and fault-tolerant asynchronous 3d links | 10 | 0.78 | 2016 |
| Thermal correlation between measurements and FEM simulations in 3D ICs | 1 | 0.41 | 2013 |
| 3D integration demonstration of a wireless product with design partitioning. | 2 | 0.99 | 2011 |
