| 320 × 240 Back-Illuminated 10-µm CAPD Pixels for High-Speed Modulation Time-of-Flight CMOS Image Sensor. | 0 | 0.34 | 2018 |
| Design and Performance of a 1 ms High-Speed Vision Chip with 3D-Stacked 140 GOPS Column-Parallel PEs. | 0 | 0.34 | 2018 |
| 4.9 A 1ms high-speed vision chip with 3D-stacked 140GOPS column-parallel PEs for spatio-temporal image processing | 6 | 0.66 | 2017 |
