Paper Info
Title
Survey of Robustness Enhancement Techniques for Wireless Systems-on-a-Chip and Study of Temperature as Observable for Process Variations
Abstract
Built-in test and on-chip calibration features are becoming essential for reliable wireless connectivity of next generation devices suffering from increasing process variations in CMOS technologies. This paper contains an overview of contemporary self-test and performance enhancement strategies for single-chip transceivers. In general, a trend has emerged to combine several techniques involving process variability monitoring, digital calibration, and tuning of analog circuits. Special attention is directed towards the investigation of temperature as an observable for process variations, given that thermal coupling through the silicon substrate has recently been demonstrated as mechanism to monitor the performances of analog circuits. Both Monte Carlo simulations and experimental results are presented in this paper to show that circuit-level specifications exhibit correlations with silicon surface temperature changes. Since temperature changes can be measured with efficient on-chip differential temperature sensors, a conceptual outline is given for the use of temperature sensors as alternative process variation monitors.
Year
DOI
Venue
2011
10.1007/s10836-011-5199-6
J. Electronic Testing
Keywords
Field
DocType
CMOS process variation,Transceiver,RF built-in test,Self-calibration,Thermal monitoring,RF thermal testing,Design for manufacturability
Monte Carlo method,Analogue electronics,Computer science,Alternative process,Electronic engineering,CMOS,Chip,Robustness (computer science),Electrical engineering,Design for manufacturability,Calibration
Journal
Volume
Issue
ISSN
27
3
0923-8174
Citations 
PageRank 
References 
3
0.47
30
Authors
6
Name
Order
Citations
PageRank
Marvin Onabajo115822.28
Didac Gómez2203.36
Eduardo Aldrete-Vidrio3141.61
Josep Altet49317.61
Diego Mateo54310.97
Jose Silva-Martinez663086.56