Title
Getting More From the Semiconductor Test: Data Mining With Defect-Cluster Extraction.
Abstract
High-volume production data shows that dies, which failed probe test on a semiconductor wafer, have a tendency to form certain unique patterns, i.e., defect clusters. Identifying such clusters is one of the crucial steps toward improvement of the fabrication process and design for manufacturing. This paper proposes a new technique for defect-cluster identification that combines data mining with a defect-cluster extraction using a Segmentation, Detection, and Cluster-Extraction algorithm. It offers high defect-extraction accuracy, without any significant increase in test time and cost.
Year
DOI
Venue
2011
10.1109/TIM.2011.2122430
IEEE T. Instrumentation and Measurement
Keywords
Field
DocType
data mining,production engineering computing,semiconductor device testing,semiconductor industry,cluster-extraction algorithm,data mining,defect-cluster extraction,defect-cluster identification,defect-extraction accuracy,detection algorithm,dies,high-volume production data,segmentation algorithm,semiconductor test,semiconductor wafer,Data mining,defect-cluster extraction,probe testing,segmentation,semiconductor manufacturing
Data mining,Cluster (physics),Wafer,Segmentation,Semiconductor device fabrication,Test data,Cluster analysis,Design for manufacturability,Mathematics,Fabrication
Journal
Volume
Issue
ISSN
60
10
0018-9456
Citations 
PageRank 
References 
2
0.41
13
Authors
6
Name
Order
Citations
PageRank
Melanie Po-Leen Ooi17018.35
Eric Kwang Joo Sim220.75
Ye Chow Kuang37219.81
Serge N. Demidenko48419.38
Lindsay Kleeman573685.03
Chris W. K. Chan620.75