Abstract | ||
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Copper (Cu) based interconnect technology is expected to meet some of the challenges of technology scaling in the pursuit of higher performance. However, Cu interconnects are still susceptible to electromigration-induced failure over time. We describe a new hierarchicalapproach for predicting the reliability of Cu-based interconnects in circuit layouts, and present an RCAD tool, SysRel, for such an analysis. We propose a (jL) product filtering algorithm with a classification of separate via-above and via-below treatments in Cu interconnect trees. After the filtering of immortal trees, a default model is applied to the remaining trees to compute reliability figures for individual units. SysRel utilizes joint stochastic reliability metrics based on the desired lifetime of a chip and combines reliability figures from individual fundamental reliability units. Simulation results with a 32-bit comparator circuit layout demonstrate the significance of our methodology in selectively identifying critical nets and their impacts on overall reliability. |
Year | DOI | Venue |
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2004 | 10.1109/ISQED.2004.1283680 | ISQED |
Keywords | Field | DocType |
cu interconnects,technology scaling,individual fundamental reliability unit,reliability figure,joint stochastic reliability metrics,circuit layout,circuit level reliability analysis,cu-based interconnects,individual unit,32-bit comparator circuit layout,overall reliability,copper,circuit analysis,electromigration,current density,reliability analysis,computer aided design,chip,filtering,system testing,electronic design automation,bit error rate,timing analysis,cu | Comparator,System testing,Computer science,Filter (signal processing),Electronic engineering,Chip,Electronic design automation,Network analysis,Interconnection,Reliability engineering,Bit error rate | Conference |
ISBN | Citations | PageRank |
0-7695-2093-6 | 16 | 1.54 |
References | Authors | |
2 | 4 |
Name | Order | Citations | PageRank |
---|---|---|---|
Syed M. Alam | 1 | 176 | 20.47 |
Chee Lip Gan | 2 | 42 | 10.12 |
Thompson, Carl V. | 3 | 50 | 11.56 |
Donald E. Troxel | 4 | 87 | 38.38 |