Title
ATPG for heat dissipation minimization during scan testing
Abstract
An ATPG technique is proposed that reduces heat dissipationduring testing of sequential circuits that have full-scan. The objectiveis to permit safe and inexpensive testing of low power circuitsand bare die that would otherwise require expensive heat removalequipment for testing at high speeds. The proposed ATPG exploitsall don't cares that occur during scan shifting, test application, andresponse capture to minimize switching activity in the circuit undertest. Furthermore, an ATPG that maximizes the number of state inputsthat are assigned don't care values, has been developed. Theproposedtechniquehas beenimplemented and usedto generatetestsfor full scan versions of ISCAS 89 benchmark circuits. These testsdecrease the average number of transitions during test by 19% to89%, when comparedwith those generatedby a simple PODEM implementation.
Year
DOI
Venue
1997
10.1145/266021.266298
DAC
Keywords
Field
DocType
bare die,heat dissipation minimization,circuit undertest,inexpensive testing,theproposedtechniquehas beenimplemented,benchmark circuit,expensive heat removalequipment,proposed atpg exploitsall,atpg technique,average number,test application,nondestructive testing,integer linear programming,sequential analysis,minimization,sequential circuits,covering problems,system testing,automatic test pattern generation
Automatic test pattern generation,Sequential logic,Computer science,System testing,Nondestructive testing,Real-time computing,Electronic engineering,Minification,Integer programming,Electronic circuit,Covering problems
Conference
ISSN
ISBN
Citations 
0738-100X
0-89791-920-3
58
PageRank 
References 
Authors
6.01
6
2
Name
Order
Citations
PageRank
Seongmoon Wang160548.50
Sandeep K. Gupta21980229.01