Name
Title | ||
|---|---|---|
Power delivery design for 3-D ICs using different through-silicon via (TSV) technologies |
Abstract | ||
|---|---|---|
3-D integrated circuits promise high bandwidth, low latency, low device power, and a small form factor. Increased device density and asymmetrical packaging, however, renders the design of 3-D power delivery a challenge. We investigate in this paper various methods to improve 3-D power delivery. We analyze the impact of through-silicon via (TSV) size and spacing, of controlled collapse chip connection (C4) spacing, and of dedicated power delivery TSVs. In addition to considering typical cylindrical or square metal-filled TSVs (core TSVs), we also investigate using coaxial TSVs for power delivery resulting in reduced routing blockages and added coupling capacitance. Our 3-D evaluation system is composed of a quad-core chip multiprocessor, a memory die, and an accelerator engine, and it is evaluated using representative SPEC benchmark traces. This is the first detailed architectural-level analysis for 3-D power delivery. Our findings provide clear guidelines for 3-D power delivery design. More importantly, we show that it is possible to achieve 2-D-like, or even better, power quality by increasing C4 granularity and by selecting suitable TSV size and spacing. |
Year | DOI | Venue |
|---|---|---|
2011 | 10.1109/TVLSI.2009.2038165 | IEEE Trans. VLSI Syst. |
Keywords | Field | DocType |
3-d integrated circuit,different through-silicon,3-d ics,coaxial tsvs,power quality,core tsvs,3-d evaluation system,low device power,3-d power delivery design,power delivery,dedicated power delivery tsvs,3-d power delivery,integrated circuit design,three dimensional,integrated circuit,3d ic,tsv,through silicon via,integrated circuit packaging,low latency,capacitance,chip,low power electronics,routing,bandwidth,form factor | Small form factor,Computer science,Integrated circuit packaging,Electronic engineering,Chip,Through-silicon via,Integrated circuit design,Three-dimensional integrated circuit,Electrical engineering,Integrated circuit,Low-power electronics | Journal |
Volume | Issue | ISSN |
19 | 4 | 1063-8210 |
Citations | PageRank | References |
26 | 1.37 | 18 |
Authors | ||
3 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Nauman H. Khan | 1 | 58 | 4.21 |
| Syed M. Alam | 2 | 176 | 20.47 |
| Soha Hassoun | 3 | 535 | 241.27 |