Name
Abstract | ||
|---|---|---|
In this paper, we present a novel architecture for embedding bi-metallic thermocouple based temperature sensors into 3D IC stacks. To the best of our knowledge this is the first work addressing this specific integration problem. Our architecture uses dedicated vias to thermally couple sensors in the metal layer with the hotspots to be monitored in the active layer throughout the multi-stack structures. We propose a low cost solution by leveraging a fraction of existing thermal TSVs for this purpose. Through thermal modeling and simulation using a state-of-the-art tool (FloTHERM), we demonstrate that we can achieve high accuracy (less than 1°C error) in temperature tracking while still maintaining the effectiveness of the thermal TSVs in heat management (conforming to a fixed peak temperature threshold of 95°C). |
Year | DOI | Venue |
|---|---|---|
2013 | 10.1109/ICCD.2013.6657046 | ICCD |
Keywords | Field | DocType |
active layer throughout,tsv (through silicon via),temperature sensors,thermal monitoring,integrating thermocouple sensor,thermocouples,heat management,flotherm tool,three-dimensional integrated circuits,3d ic stack,embedding bimetallic thermocouple,thermal management (packaging),multistack structure,thermal modeling,integrated circuit packaging,bi-metallic thermocouple,thermal tsv,3d ic,temperature sensor,temperature 95 degc | Active layer,Thermal,Embedding,Thermocouple,Stack (abstract data type),Computer science,Modeling and simulation,Integrated circuit packaging,Electronic engineering,Three-dimensional integrated circuit,Electrical engineering | Conference |
Citations | PageRank | References |
3 | 0.40 | 17 |
Authors | ||
3 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Dawei Li | 1 | 7 | 2.23 |
| Ji-Hoon Kim | 2 | 68 | 10.13 |
| Seda Öǧrenci Memik | 3 | 488 | 42.57 |