Name
Abstract | ||
|---|---|---|
Stacking core layers is emerging as an alternative for future high performance computing, but thermal problems have to be tackled first. When adaptive voltage scaling is adopted to hide the growing variation in the performance of cores, as a result, heat generation of each core varies. By exploiting the static thermal characteristics, the efficiency of dynamic thermal management can be improved. The proposed thermal management reduces the energy consumption by up to 30.02% compared with existing techniques, while keeping the ratio of temperature violations around 1%. |
Year | DOI | Venue |
|---|---|---|
2013 | 10.1587/elex.10.20130800 | IEICE ELECTRONICS EXPRESS |
Keywords | Field | DocType |
3D, multicore, dynamic thermal management, process variations | Computer science,Thermal management of electronic devices and systems,Electronic engineering,Multi-core processor,Embedded system | Journal |
Volume | Issue | ISSN |
10 | 23 | 1349-2543 |
Citations | PageRank | References |
0 | 0.34 | 0 |
Authors | ||
4 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Hyejeong Hong | 1 | 32 | 5.16 |
| Jaeil Lim | 2 | 10 | 3.69 |
| Hyunyul Lim | 3 | 20 | 4.46 |
| Sungho Kang | 4 | 436 | 78.44 |