Name
Title | ||
|---|---|---|
Study on compatible CMOS-MEMS process with surface micromachining for the application of monolithic integration |
Abstract | ||
|---|---|---|
In this work, compatible CMOS-MEMS process with surface micromachining is investigated. Surface micromachining method for cantilever fabrication has been merged with conventional CMOS process, and release of MEMS structure is conducted after CMOS process. We designed polysilicon MEMS structures as well as CMOS devices and circuits on a monolithic sensor chip for the investigation of the influence of stress induced by non-adequate post-CMOS annealing. The impact of step coverage and the releasing process on both the MEMS and CMOS components are also discussed. |
Year | DOI | Venue |
|---|---|---|
2014 | 10.1109/NEMS.2014.6908861 | Nano/Micro Engineered and Molecular Systems |
Keywords | DocType | ISSN |
cmos integrated circuits,micromachining,monolithic integrated circuits,cmos mems process,cmos devices,cantilever fabrication,monolithic integration,monolithic sensor chip,step coverage,surface micromachining,mems,post-cmos,stress,fabrication | Conference | 2474-3747 |
Citations | PageRank | References |
0 | 0.34 | 0 |
Authors | ||
7 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| danqi zhao | 1 | 0 | 0.34 |
| xian huang | 2 | 0 | 1.01 |
| jun he | 3 | 0 | 1.01 |
| li zhang | 4 | 0 | 1.01 |
| peng liu | 5 | 0 | 0.68 |
| fang yang | 6 | 0 | 1.69 |
| Dacheng Zhang | 7 | 32 | 12.02 |