Title
Deformations of ic structure in test and yield learning
Abstract
This paper argues that the existing approaches to modeling and characterization of IC malfunctions are inadequate for test and yield learning of Deep Sub-Micron (DSM) products. Traditional notions of a spot defect and local and global pro- cess variations are analyzed and their shortcomings are exposed. A detailed taxonomy of process-induced deforma- tions of DSM IC structures, enabling modeling and charac- terization of IC malfunctions, is proposed. The blueprint of a roadmap enabling such a characterization is suggested.
Year
DOI
Venue
2003
10.1109/TEST.2003.1271071
Test Conference, 2003. Proceedings. ITC 2003. International
Keywords
Field
DocType
defect characterization.,diagno- sis,fault modeling,: yield learning,defects,integrated circuit layout,taxonomy,geometry,fault model,boolean algebra
Prime (order theory),Integrated circuit layout,Existential quantification,Computer science,IC layout editor,Electronic engineering,Blueprint,Boolean algebra,Physical design,Integrated circuit development
Conference
Volume
ISSN
ISBN
1
1089-3539
0-7803-8106-8
Citations 
PageRank 
References 
23
1.41
28
Authors
4
Name
Order
Citations
PageRank
Wojciech Maly11976352.57
Gattiker, A.2231.41
T. Zanon3352.58
Vogels, T.4231.41