Title
Digital-signal-waveform improvement on VLSI packaging including inductances
Abstract
As the digital signal frequency in printed circuit boards (PCBs) increases, waveform distortion, or the signal integrity (SI) problem, is getting more and more serious. The reason the SI problem is becoming serious is that wires or traces need to be regarded as transmission lines which are sensitive to electric noise. In order to overcome this problem, we have proposed a novel methodology called a segmental transmission line (STL), and have shown its effectiveness using computer simulations and fundamental prototypes. However, in the STL design, the combinatorial explosion problem occurs. To solve this problem, a genetic algorithm (GA) was used to design the STL. In this article, we apply the STL to a bus system that includes inductances, which come from the very-large-scale integration (VLSI) packaging. We evaluated the STL in simulation experiments as well as actual experiments using prototypes, and obtained a maximum improvement ratio of 1.53 in the actual experiment.
Year
DOI
Venue
2011
10.1007/s10015-011-0915-y
Artificial Life and Robotics
Keywords
DocType
Volume
Signal integrity, Transmission line, Genetic algorithms, Inductance, Printed circuit board
Journal
16
Issue
ISSN
Citations 
2
1614-7456
0
PageRank 
References 
Authors
0.34
0
6
Name
Order
Citations
PageRank
hiroki shimada100.34
shohei akita200.34
Masami Ishiguro300.68
Noriyuki Aibe4124.99
Ikuo Yoshihara512018.53
Moritoshi Yasunaga617833.03