Name
Title | ||
|---|---|---|
A method to evaluate the influence of different substrate on stress mismatch induced deformation in MEMS accelerometer |
Abstract | ||
|---|---|---|
This paper presents a method to evaluate the influence of stress mismatch between sensor structure and different die-attachment on the thermal stability of accelerometers. The local deformation of MEMS accelerometers under different thermal load and differential die-attachment conditions are investigated. White light interferometer and a home-made heating stage are used to carry out the measurement. Capacitance variations of differential capacitors can be calculated based on the data of the local deformation of MEMS accelerometers. Both the visual evidences and calculated capacitance variations in this work can give clear guidance to optimize both the structural design and packaging conditions. |
Year | DOI | Venue |
|---|---|---|
2015 | 10.1109/NEMS.2015.7147458 | NEMS |
Keywords | Field | DocType |
thermal reliability, temperature drift, deformation, capacitance variation, packaging, structural design | Substrate (chemistry),Composite material,Microelectromechanical systems,Accelerometer,Deformation (mechanics),Materials science | Conference |
ISSN | Citations | PageRank |
2474-3747 | 0 | 0.34 |
References | Authors | |
0 | 7 | |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Jun You | 1 | 0 | 0.34 |
| Dayu Tian | 2 | 0 | 0.34 |
| Chunhua He | 3 | 4 | 4.34 |
| Qiancheng Zhao | 4 | 1 | 3.74 |
| Zhenchuan Yang | 5 | 23 | 12.18 |
| Dacheng Zhang | 6 | 32 | 12.02 |
| Guizhen Yan | 7 | 34 | 12.22 |