Name
Abstract | ||
|---|---|---|
We present a full system integration of a thermoelectric energy harvesting system as an on-chip component into a 3D IC. Our system incorporates a lithographically patterned bi-metallic thin-film thermocouple network with a switched capacitor power converter and a charge buffer capacitor to harvest thermal energy produced by temperature gradients in typical 3D IC structures. Through heat transfer and transistor-level circuit simulations we demonstrate the energy harvesting potential of our system to power a low energy circuit component. Our proposed thin film based harvester does not require package re-design, since it is integrated on-chip using low cost CMOS compatible material. We evaluated integration of our proposed system into a 3D stacking of processor cores and DRAM memory. Even when operating at a conservative thermal bound of 84 degrees C sufficient energy is harvested to continuously sustain a low-power adder for 29,640 cycles of single bit additions or 463 cycles of 64-bit additions with 12usec charging delay. Effectively we can run the adder continuously with less than 0.80% delay between bursts of operations. |
Year | DOI | Venue |
|---|---|---|
2015 | 10.1109/ISCAS.2015.7168824 | 2015 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS) |
Field | DocType | ISSN |
Capacitor,System on a chip,Thermal energy,Adder,Computer science,Energy harvesting,Switched capacitor,Electronic engineering,Three-dimensional integrated circuit,Electrical engineering,Thermoelectric effect | Conference | 0271-4302 |
Citations | PageRank | References |
0 | 0.34 | 0 |
Authors | ||
3 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Dawei Li | 1 | 7 | 2.23 |
| Seda Öǧrenci Memik | 2 | 488 | 42.57 |
| Lawrence J. Henschen | 3 | 478 | 280.94 |