Name
Title | ||
|---|---|---|
Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer |
Abstract | ||
|---|---|---|
This paper proposes 3D stacked module consisting of image sensor and digital logic dies connected through inductive coupling channels. Evaluation of a prototype module revealed radiation noise from the inductive coils to the image sensor is less than 0.4-LSB range along with ADC code, i.e., negligible. Aiming at high frame rate image sensor/processing module exploiting this attractive off-die interface, we also worked on resolving another throughput-limiter, namely power consuming TDC used in column parallel ADCs. Novel intermittent TDC operation scheme presented in this paper can reduce its power dissipation 57% from conventional ones. |
Year | Venue | Field |
|---|---|---|
2015 | Symposium on VLSI Circuits-Digest of Papers | Image sensor,Noise measurement,Inductive coupling,Dissipation,Computer science,Communication channel,Image noise,Electronic engineering,Frame rate,Very-large-scale integration,Electrical engineering |
DocType | Citations | PageRank |
Conference | 3 | 0.52 |
References | Authors | |
0 | 9 | |
Name | Order | Citations | PageRank |
|---|---|---|---|
| M. Ikebe | 1 | 47 | 13.63 |
| Daisuke Uchida | 2 | 3 | 0.86 |
| Yasuhiro Take | 3 | 95 | 10.24 |
| Makito Someya | 4 | 3 | 0.52 |
| Satoshi Chikuda | 5 | 3 | 0.52 |
| Kento Matsuyama | 6 | 3 | 0.52 |
| Tetsuya Asai | 7 | 121 | 26.53 |
| Tadahiro Kuroda | 8 | 659 | 213.23 |
| Masato Motomura | 9 | 91 | 27.81 |