Title
Test Time Reduction on Testing Delay Faults in 3D ICs Using Boundary Scan Design
Abstract
A boundary scan design with embedded time-to-digital converter (TDCBS) has been proposed for testing small delay faults. In this paper, the TDCBS is applied for testing TSVs in 3D IC. To reduce test application time of the TDCBS, we propose a modified TAP controller that utilizes the bypass mode for reducing unnecessary scan shifts during observation of the captured results. The simulation for an experimental circuit is shown to evaluate the effectiveness of the proposed method.
Year
DOI
Venue
2018
10.1109/ATS.2018.00013
2018 IEEE 27th Asian Test Symposium (ATS)
Keywords
Field
DocType
delay fault testing,TSV,boundary scan,TDC,design-for-testability
Boundary scan,Design for testing,Control theory,Computer science,Electronic engineering,Three-dimensional integrated circuit
Conference
ISSN
ISBN
Citations 
1081-7735
978-1-5386-9467-1
0
PageRank 
References 
Authors
0.34
8
3
Name
Order
Citations
PageRank
Satoshi Hirai100.34
Hiroyuki Yotsuyanagi27019.04
Masaki Hashizume39827.83