Author Info
Name
Affiliation
Papers
P. S. ANDRY
IBM Research Division, Thomas J. Watson Research Center, Yorktown Heights, New York
5
Collaborators
Citations 
PageRank 
33
106
22.38
Referers 
Referees 
References 
376
186
34
Search Limit
100376
Title
Citations
PageRank
Year
Fabrication and characterization of robust through-silicon vias for silicon-carrier applications176.042008
3D chip stacking with C4 technology61.192008
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections182.532008
Three-dimensional silicon integration373.342008
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection289.292005