Author Info
Name
Affiliation
Papers
C. S. PATEL
IBM Research Division, Thomas J. Watson Research Center
5
Collaborators
Citations 
PageRank 
33
188
22.62
Referers 
Referees 
References 
507
214
45
Search Limit
100507
Title
Citations
PageRank
Year
3D chip stacking with C4 technology61.192008
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections182.532008
Three-dimensional silicon integration373.342008
Statistical Properties of Amplify and Forward Relay Fading Channels996.282006
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection289.292005