Sebastien Thuries - Citegraph

Author Info

Name	Affiliation	Papers
SEBASTIEN THURIES	CEA Grenoble, LETI, F-38054 Grenoble, France	17
Collaborators	Citations	PageRank
107	27	7.32
Referers	Referees	References
108	255	60

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Publications (17 rows)

Collaborators (100 rows)

Referers (100 rows)

Referees (100 rows)

Title	Citations	PageRank	Year
IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management	3	0.45	2021
2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm<sup>2</sup> Inter-Chiplet Interconnects and 156mW/mm<sup>2</sup>@ 82%-Peak-Efficiency DC-DC Converters	0	0.34	2020
Test Solutions for High Density 3D-IC Interconnects - Focus on SRAM-on-Logic Partitioning	0	0.34	2019
Advanced 3d Technologies And Architectures For 3d Smart Image Sensors	0	0.34	2019
Monolithic 3D: an alternative to advanced CMOS scaling, technology perspectives and associated design methodology challenges	0	0.34	2018
Transistor Temperature Deviation Analysis in Monolithic 3D Standard Cells.	0	0.34	2017
7.5 A TCXO-less 100Hz-minimum-bandwidth transceiver for ultra-narrow-band sub-GHz IoT cellular networks	2	0.58	2017
Cell-on-Buffer: New design approach for high-performance and low-power monolithic 3D integrated circuits.	0	0.34	2017
Drc2: Dynamically Reconfigurable Computing Circuit Based On Memory Architecture	0	0.34	2016
Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes	0	0.34	2016
Opportunities brought by sequential 3D CoolCube™ integration	0	0.34	2016
Recent advances in 3D VLSI integration	0	0.34	2016
Intermediate BEOL process influence on power and performance for 3DVLSI	0	0.34	2015
From 2D to Monolithic 3D: Design Possibilities, Expectations and Challenges	1	0.37	2015
A comprehensive study of monolithic 3D cell on cell design using commercial 2D tool.	15	1.03	2015
An Unbalanced Area Ratio Study for High Performance Monolithic 3D Integrated Circuits	3	0.59	2015
3DCoB: A new design approach for Monolithic 3D Integrated circuits.	3	0.58	2014

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