Heegon Kim - Citegraph

Author Info

Name	Affiliation	Papers
HEEGON KIM	Korea Adv Inst Sci & Technol, Dept Elect Engn, Taejon 305701, South Korea	19
Collaborators	Citations	PageRank
44	15	7.69
Referers	Referees	References
61	75	27

Publications (19 rows)

Collaborators (44 rows)

Referers (61 rows)

Referees (75 rows)

Title	Citations	PageRank	Year
Multispectral interaction convolutional neural network for pedestrian detection	0	0.34	2022
Design of an On-Silicon-Interposer Passive Equalizer for Next Generation High Bandwidth Memory With Data Rate Up To 8 Gb/s.	0	0.34	2018
High-Frequency Temperature-Dependent Through-Silicon Via (TSV) Model and High-Speed Channel Performance for 3D IC	1	0.37	2016
TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC	0	0.34	2015
Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module	1	0.40	2015
Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation	3	0.39	2015
Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC	0	0.34	2015
Cpu-Gpu Hybrid Computing For Feature Extraction From Video Stream	3	0.47	2014
Analysis and optimization of a power distribution network in 2.5D IC with glass interposer	0	0.34	2014
Fault detection and isolation of multiple defects in through silicon via (TSV) channel	0	0.34	2014
Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs	1	0.63	2014
Power-Time Tradeoff of Parallel Execution on Multi-core Platforms.	1	0.37	2013
Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling	0	0.34	2013
Eye-diagram simulation and analysis of a high-speed TSV-based channel	0	0.34	2013
Design Of Contact Less Wafer-Level Tsv Connectivity Testing Structure Using Capacitive Coupling	0	0.34	2013
Parallelizing H.264 and AES Collectively.	0	0.34	2013
Fault isolation of short defect in through silicon via (TSV) based 3D-IC.	3	0.96	2013
Non-contact wafer-level TSV connectivity test methodology using magnetic coupling	2	0.39	2013
Overcoming Amdahl's Law by Distributing Workload Asymmetrically.	0	0.34	2012

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