Name
Affiliation
Papers
OLIVIER BILLOINT
CEA Grenoble, LETI, F-38054 Grenoble, France
20
Collaborators
Citations 
PageRank 
107
33
8.59
Referers 
Referees 
References 
116
293
72
Search Limit
100293
Title
Citations
PageRank
Year
Area and Cost Analysis of the Mixed Signal Circuits in a Novel Monolithic 3D Process00.342021
Synchronized Interconnected ADPLLs for Distributed Clock Generation in 65 nm CMOS Technology.10.482019
Monolithic 3D: an alternative to advanced CMOS scaling, technology perspectives and associated design methodology challenges00.342018
Transistor Temperature Deviation Analysis in Monolithic 3D Standard Cells.00.342017
Cell-on-Buffer: New design approach for high-performance and low-power monolithic 3D integrated circuits.00.342017
Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes00.342016
Opportunities brought by sequential 3D CoolCube™ integration00.342016
Recent advances in 3D VLSI integration00.342016
UTBB FDSOI technology flexibility for ultra low power internet-of-things applications10.392015
Intermediate BEOL process influence on power and performance for 3DVLSI00.342015
From 2D to Monolithic 3D: Design Possibilities, Expectations and Challenges10.372015
A comprehensive study of monolithic 3D cell on cell design using commercial 2D tool.151.032015
A distributed synchronization of all-digital PLLs network for clock generation in synchronous SOCs10.382015
An Unbalanced Area Ratio Study for High Performance Monolithic 3D Integrated Circuits30.592015
3D technologies for reconfigurable architectures00.342014
27.1 A 460MHz at 397mV, 2.6GHz at 1.3V, 32b VLIW DSP, embedding F MAX tracking00.342014
3DCoB: A new design approach for Monolithic 3D Integrated circuits.30.582014
A high-level design rule library addressing CMOS and heterogeneous technologies00.342014
Ultra-wide voltage range designs in fully-depleted silicon-on-insulator FETs60.602013
Fpga Prototyping Of Large Reconfigurable Adpll Network For Distributed Clock Generation20.452013