| IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management | 3 | 0.45 | 2021 |
| 2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm<sup>2</sup> Inter-Chiplet Interconnects and 156mW/mm<sup>2</sup>@ 82%-Peak-Efficiency DC-DC Converters | 0 | 0.34 | 2020 |
| A 29 Gops/Watt 3D-Ready 16-Core Computing Fabric with Scalable Cache Coherent Architecture Using Distributed L2 and Adaptive L3 Caches. | 0 | 0.34 | 2018 |
| A Programmable Inbound Transfer Processor for Active Messages in Embedded Multicore Systems | 0 | 0.34 | 2017 |
| A 4 × 4 × 2 Homogeneous Scalable 3D Network-on-Chip Circuit With 326 MFlit/s 0.66 pJ/b Robust and Fault Tolerant Asynchronous 3D Links. | 2 | 0.47 | 2017 |
| 8.1 a 4x4x2 homogeneous scalable 3d network-on-chip circuit with 326mflit/s 0.66pj/b robust and fault-tolerant asynchronous 3d links | 10 | 0.78 | 2016 |
| 27.1 A 460MHz at 397mV, 2.6GHz at 1.3V, 32b VLIW DSP, embedding F MAX tracking | 0 | 0.34 | 2014 |
| A low-power VLIW processor for 3GPP-LTE complex numbers processing | 8 | 0.74 | 2011 |
| A 477mW NoC-based digital baseband for MIMO 4G SDR. | 19 | 1.11 | 2010 |
| Digital timing slack monitors and their specific insertion flow for adaptive compensation of variabilities | 4 | 0.46 | 2009 |
