Title
Voltage and temperature effect on dielectric charging for RF-MEMS capacitive switches reliability investigation
Abstract
In this paper, we study the effect of stress voltage and temperature on the dielectric charging and discharging processes of silicon nitride thin films used in RF-MEMS capacitive switches. The investigation has been performed on PECVD-SiNx dielectric materials deposited under different deposition conditions. The leakage current was found to obey the Poole–Frenkel law. The charging current decay was found to be affected by the presence of defects which are generated by electron injection at high electric fields. At high temperatures power law decay was monitored. Finally, the temperature dependence of leakage current revealed the presence of thermally activated mechanisms with similar activation energies in all materials.
Year
DOI
Venue
2008
10.1016/j.microrel.2008.07.017
Microelectronics Reliability
Keywords
Field
DocType
thin film,power law,activation energy,electric field,leakage current
Plasma-enhanced chemical vapor deposition,Electric field,Leakage (electronics),Dielectric,Voltage,Chemistry,Capacitive sensing,Electronic engineering,Poole–Frenkel effect,Silicon nitride
Journal
Volume
Issue
ISSN
48
8
0026-2714
Citations 
PageRank 
References 
10
2.06
3
Authors
9
Name
Order
Citations
PageRank
M. Lamhamdi12811.09
P. Pons24918.02
Usama Zaghloul3286.35
L. Boudou4176.55
F. Coccetti54011.42
J. Guastavino6176.55
Y. Segui7176.55
G. Papaioannou8358.62
R. Plana9102.06